Prof. Duane S Boning

Clarence J LeBel Professor of Electrical Engineering
Associate Chair of the Faculty
Associate Director for Computation, Microsystems Technology Laboratories (MTL)
Engineering Faculty Co-Director, Leaders for Global Operations (LGO) Program

Primary DLC

Department of Electrical Engineering and Computer Science

MIT Room: 39-415A

Areas of Interest and Expertise

Semiconductor Manufacturing<br>Metrology and Modeling of IC and MEMS Process, Device and Circuit Variation<br>Computer Tools and Systems for Statistical Design for Manufacturability, and Environmentally Benign Manufacturing
Chemical Mechanical Polishing (CMP)
Plasma Etch and Imprint/Embossing Processes
Manufacturing Process Technology

Research Summary

Professor Boning's research interests include the modeling and control of variation in IC, photonics, and MEMS processes, devices, and circuits. Particular emphasis is on statistical characterization and design for manufacturing of devices and circuits in advanced technologies, and the modeling of chemical mechanical polishing (CMP), spin-on coatings, plasma etch, and nanoimprint/embossing processes.

Recent Work

  • Video
    November 20, 2019Conference Video Duration: 41:10

    Duane Boning - 2019 RD Conference

    Machine Intelligence for Manufacturing and Operations: Opportunities and Challenges

    The large amounts of both structured and unstructured data created in manufacturing and operations today present enormous opportunities to apply advanced analytics, machine learning and deep learning. This talk will describe specific use cases in process control and optimization; yield prediction and enhancement; defect inspection and classification and anomaly detection in time series data. Additionally, some of the unique manufacturing and operations challenges like: class imbalance, concept drift and complex multivariate time dynamics will be described. This research has led to the creation of MIT MIMO (Machine Intelligence for Manufacturing and Operations) which will be described during this talk.

    2019 MIT Research and Development Conference