Prof. Jesus A del Alamo

Donner Professor of Science
MacVicar Faculty Fellow

Primary DLC

Microsystems Technology Laboratories

MIT Room: 38-246

Areas of Interest and Expertise

Integrated Microelectronic Devices: Physics, Modeling, Design and Technology
Gigahertz Power Transistors for Communications
Field-Effect Transistors Using 111-V Compound Semiconductors for Beyond Si CMOS Logic Applications<br>Reliability of 111-V and GaN Field-Effect Transistors<br>High Electron Mobility Transistors for Teraherz Applications

Research Summary

Del Alamo leads a research program on silicon and compound semiconductor transistor technologies for radio frequency, microwave, and millimeter wave applications. He has conducted research on a range of transistor technologies and other electronic devices in a variety of material systems, including solar cells and quantum-effect devices. His current research interests focus on the physics, technology, modeling and reliability of new III-V compound semiconductor field-effect transistors for future logic applications. In addition, del Alamo is the founder of the iLab Project that pioneered the technology and teaching of online laboratories for science and engineering.

Recent Work

  • Video

    5.5.22-Efficient-AI-Jesús-delAlamo

    May 5, 2022Conference Video Duration: 16:1
    Jesús A. del Alamo
    Donner Professor in the School of Engineering

    5.5.22-Efficient-AI-Panel

    May 5, 2022Conference Video Duration: 44:2
    Jesús A. del Alamo
    Donner Professor in the School of Engineering
    Joel Emer
    Professor of the Practice
    Department of Electrical Engineering and Computer Science, MIT CSAIL
    Song Han
    Assistant Professor, Department of Electrical Engineering and Computer Science, MIT EECS
    Rajesh Pankaj
    Senior Vice President of Engineering
    Head of the Corporate Research and Development (CR&D) , Qualcomm Technologies
    Varada Gopalakrishnan
    VP/Distinguished Engineer, Amazon Devices

    10.14.20-MRL-After-Moores-delAlamo

    October 14, 2020Conference Video Duration: 26:30
    3D integration: above and beyond Moore’s Law