2026 MIT Enterprise AI Forum

Scaling AI for Real-World Implementation and Impact

April 15, 2026
9:00 AM - 12:00 PM EST
2026 MIT Enterprise AI Forum
Forum

Location

MIT Industry Meeting Center (E90)
1 Main Street, 12th Floor
Cambridge, MA 02142


Forum Recordings

Recordings will be available exclusively to ILP members. To learn more about becoming a member, click here.

ILP Members

Review our 2025 AI Conference summary and examine the year’s key developments.


Overview

Join MIT faculty, senior executives, and entrepreneurs for a strategic forum on how AI is reshaping industrial operations and unlocking enterprise-scale transformation. This event will highlight actionable insights and breakthrough applications across mission-critical areas, including:

  • AI vision systems for automated quality assurance
  • Driving a zero-defect future in manufacturing
  • Digital twins for intelligent product lifecycle management
  • Advanced process analytics and root-cause learning
  • Interpretable AI for transparent, risk-aware decision-making
  • Vision and sensing technologies for real-time fraud detection

Discover how MIT researchers and industry executives are partnering to deliver scalable, reliable, and interpretable AI solutions that accelerate operational excellence and strengthen competitive advantage.


Visiting MIT: https://www.mit.edu/visitmit/
Where to Stay: https://institute-events.mit.edu/visit/where-to-stay
Registration Questions: ocrevents@mit.edu

The agenda will be announced soon. 

  • Overview

    Join MIT faculty, senior executives, and entrepreneurs for a strategic forum on how AI is reshaping industrial operations and unlocking enterprise-scale transformation. This event will highlight actionable insights and breakthrough applications across mission-critical areas, including:

    • AI vision systems for automated quality assurance
    • Driving a zero-defect future in manufacturing
    • Digital twins for intelligent product lifecycle management
    • Advanced process analytics and root-cause learning
    • Interpretable AI for transparent, risk-aware decision-making
    • Vision and sensing technologies for real-time fraud detection

    Discover how MIT researchers and industry executives are partnering to deliver scalable, reliable, and interpretable AI solutions that accelerate operational excellence and strengthen competitive advantage.


    Visiting MIT: https://www.mit.edu/visitmit/
    Where to Stay: https://institute-events.mit.edu/visit/where-to-stay
    Registration Questions: ocrevents@mit.edu

    The agenda will be announced soon. 

Register

Agenda


Semiconductor Process Modeling, Defect Analytics

Vice Provost for International Activities, MIT 
Clarence J. LeBel Professor in Electrical Engineering, MIT 
Professor, MIT Department of Electrical Engineering and Computer Science

Duane Boning

Vice Provost for International Activities, MIT 
Clarence J. LeBel Professor in Electrical Engineering, MIT 
Professor, MIT Department of Electrical Engineering and Computer Science

Duane Boning is the vice provost for international activities, providing intellectual leadership, guidance, and oversight of the Institute’s international engagements and policies. As the Clarence J. LeBel Professor in the Department of Electrical Engineering and Computer Science (EECS), his research focuses on machine learning and statistical methods for modeling and control of variation in semiconductor and photonic manufacturing processes, devices, and circuits, with more than 300 journal and conference publications on these topics.

Prior to joining the faculty MIT, in 1992, Boning worked at Texas Instruments from 1991 through 1992. He served as editor-in-chief of the IEEE Transactions on Semiconductor Manufacturing from 2001 to 2011. He has held several leadership positions at the Institute, serving as associate department head of EECS from 2004 to 2011 and as associate chair of the MIT Faculty from 2019 to 2021. Among his previous leadership roles in international collaborations, Boning served as faculty lead of the MIT/Masdar Institute Cooperative Program and faculty lead of the MIT Skoltech initiative. He is currently the engineering faculty co-director for MIT’s Leaders for Global Operations Program and faculty co-director for the Machine Intelligence in Manufacturing and Operations effort. Boning is a Fellow of the IEEE for contributions to modeling and control in semiconductor manufacturing.

Boning earned his SB, SM, and PhD degrees from MIT in electrical engineering and computer science.

  • Agenda

    Semiconductor Process Modeling, Defect Analytics

    Vice Provost for International Activities, MIT 
    Clarence J. LeBel Professor in Electrical Engineering, MIT 
    Professor, MIT Department of Electrical Engineering and Computer Science

    Duane Boning

    Vice Provost for International Activities, MIT 
    Clarence J. LeBel Professor in Electrical Engineering, MIT 
    Professor, MIT Department of Electrical Engineering and Computer Science

    Duane Boning is the vice provost for international activities, providing intellectual leadership, guidance, and oversight of the Institute’s international engagements and policies. As the Clarence J. LeBel Professor in the Department of Electrical Engineering and Computer Science (EECS), his research focuses on machine learning and statistical methods for modeling and control of variation in semiconductor and photonic manufacturing processes, devices, and circuits, with more than 300 journal and conference publications on these topics.

    Prior to joining the faculty MIT, in 1992, Boning worked at Texas Instruments from 1991 through 1992. He served as editor-in-chief of the IEEE Transactions on Semiconductor Manufacturing from 2001 to 2011. He has held several leadership positions at the Institute, serving as associate department head of EECS from 2004 to 2011 and as associate chair of the MIT Faculty from 2019 to 2021. Among his previous leadership roles in international collaborations, Boning served as faculty lead of the MIT/Masdar Institute Cooperative Program and faculty lead of the MIT Skoltech initiative. He is currently the engineering faculty co-director for MIT’s Leaders for Global Operations Program and faculty co-director for the Machine Intelligence in Manufacturing and Operations effort. Boning is a Fellow of the IEEE for contributions to modeling and control in semiconductor manufacturing.

    Boning earned his SB, SM, and PhD degrees from MIT in electrical engineering and computer science.